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 6MBI100UB-120
IGBT Module U-Series
Features
* High speed switching * Voltage drive * Low inductance module structure
1200V / 100A 6 in one-package
Applications
* Uninterruptible power supply * Inverter for Motor drive * AC and DC Servo drive amplifier * Industrial machines, such as Welding machines
Maximum ratings and characteristics
Absolute maximum ratings (at Tc=25C unless otherwise specified)
Item Collector-Emitter voltage Gate-Emitter voltaga Collector current Symbol VCES VGES IC ICp -IC -IC pulse PC Tj Tstg Viso Conditions Rating 1200 20 150 100 300 200 100 200 520 +150 -40 to +125 2500 3.5 Unit V V A
Continuous Tc=25C Tc=80C 1ms Tc=25C Tc=80C
Collector Power Dissipation Junction temperature Storage temperature Isolation voltage between terminal and copper base *1 between thermistor and others *2 Screw Torque Mounting *3
1 device
W C VAC N*m
AC:1min.
*1 : All terminals should be connected together when isolation test will be done. *2 : Two thermistor terminals should be connected together, each other terminals should be connected together and shorted to base plate when isolation test will be done. *3 :Recommendable value : 2.5 to 3.5 N*m(M5)
Electrical characteristics (at Tj=25C unless otherwise specified)
Item Zero gate voltage collector current Gate-Emitter leakage current Gate-Emitter threshold voltage Collector-Emitter saturation voltage Symbols ICES IGES VGE(th) VCE(sat) (terminal) VCE(sat) (chip) Cies ton tr tr(i) toff tf VF (terminal) VF (chip) trr R lead R Conditions VGE=0V, VCE=1200V VCE=0V, VGE=20V VCE=20V, IC=100mA VGE=15V, IC=100A Tj=25C Tj=125C Tj=25C Tj=125C VCE=10V, VGE=0V, f=1MHz VCC=600V IC=100A VGE=15V RG=5.6 VGE=0V IF=100A Tj=25C Tj=125C Tj=25C Tj=125C Characteristics Min. Typ. - - - - 4.5 6.5 - 2.10 - 2.35 - 1.75 - 2.00 - 11 - 0.36 - 0.21 - 0.03 - 0.37 - 0.07 - 1.95 - 2.05 - 1.60 - 1.70 - - - 3.4 - 5000 465 495 3305 3375 Unit Max. 1.0 200 8.5 2.45 - 2.10 - - 1.20 0.60 - 1.00 0.30 2.25 - 1.90 - 0.35 - - 520 3450 mA nA V V
Inverter
Input capacitance Turn-on time
nF s
Turn-off time Forward on voltage
V
Thermistor
Reverse recovery time Lead resistance, terminal-chip*4 Resistance
IF=100A T=25C T=100C T=25/50C
s m
B value B *4:Biggest internal terminal resistance among arm.
Thermal resistance characteristics
Items Thermal resistance Contact Thermal resistance Symbols Rth(j-c) Rth(j-c) Rth(c-f)*5 Conditions IGBT FWD With thermal compound Characteristics Min. Typ. - - - - - 0.05 Unit Max. 0.24 0.39 - C/W C/W C/W
*5 : This is the value which is defined mounting on the additional cooling fin with thermal compound.
6MBI100UB-120
Characteristics (Representative)
Collector current vs. Collector-Emitter voltage (typ.) Tj= 25C / chip
250 VGE=20V 15V 12V Collector current : Ic [A] 250 VGE=20V
IGBT Module
Collector current vs. Collector-Emitter voltage (typ.) Tj= 125C / chip
200 Collector current : Ic [A]
200
15V
12V
150 10V
150
100
100
10V
50 8V 0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
50 8V 0 0 1 2 3 4 5 Collector-Emitter voltage : VCE [V]
Collector current vs. Collector-Emitter voltage (typ.) VGE=15V / chip
250 T j=25C T j=125C 10
Collector-Emitter voltage vs. Gate-Emitter voltage (typ.) Tj=25C / chip
200 Collector current : Ic [A]
Collector - Emitter voltage : VCE [ V ]
8
150
6
100
4
50
2
Ic=200A Ic=100A Ic= 50A
0 0 1 2 3 4
0 5 10 15 20 25
Collector-Emitter voltage : VCE [V]
Gate - Emitter voltage : VGE [ V ]
Capacitance vs. Collector-Emitter voltage (typ.) VGE=0V, f= 1M Hz, Tj= 25C
100.0 Collector-Emitter voltage : VCE [ 200V/div ] Gate - Emitter voltage : VGE [ 5V/div ]
Dynamic Gate charge (typ.) Vcc=600V, Ic=100A, Tj= 25C
Capacitance : Cies, Coes, Cres [ nF ]
Cies 10.0
VGE
Cres 1.0
Coes 0.1 0 10 20 30
0 0 200
VCE 400 600
Collector-Emitter voltage : VCE [V]
Gate charge : Qg [ nC ]
6MBI100UB-120
Switching time vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=5.6 ohm, Tj= 25C
10000 10000
IGBT Module
Switching time vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=5.6 ohm, Tj=125C
Switching time : ton, tr, toff, tf [ nsec ]
Switching time : ton, tr, toff, tf [ nsec ]
1000 ton toff tr 100 tf
1000 toff ton tr 100
tf
10 0 50 100 150 200 Collector current : Ic [ A ]
10 0 50 100 150 200 Collector current : Ic [ A ]
Switching time vs. Gate resistance (typ.) Vcc=600V, Ic=100A, VGE=15V, Tj= 25C
10000 Switching loss : Eon, Eoff, Err [ mJ/pulse ] 20
Switching loss vs. Collector current (typ.) Vcc=600V, VGE=15V, Rg=5.6 ohm
Eoff(125C) Switching time : ton, tr, toff, tf [ nsec ] ton toff 1000 Eon(125C) 15 Eoff(25C) 10 Eon(25C)
tr 100 tf
5
Err(125C) Err(25C)
10 0.1 1.0 10.0 100.0 1000.0
0 0 50 100 150 200 Gate resistance : Rg [ ] Collector current : Ic [ A ]
Switching loss vs. Gate resistance (typ.) Vcc=600V, Ic=100A, VGE=15V, Tj= 125C
100 Switching loss : Eon, Eoff, Err [ mJ/pulse ] 300
Reverse bias safe operating area (max.) +VGE=15V,-VGE <= 15V, RG >= 5.6 ohm ,Tj <= 125C
Eon Collector current : Ic [ A ] 1000.0 75 200
50
100
25
Eoff
0 0.1 1.0 10.0 100.0
Err
0 0 400 800 1200 Collector - Emitter voltage : VCE [ V ]
Gate resistance : Rg [ ]
6MBI100UB-120
Forward current vs. Forward on voltage (typ.) chip
250 T j=25C Reverse recovery current : Irr [ A ] Reverse recovery time : trr [ nsec ] 1000
IGBT Module
Reverse recovery characteristics (typ.) Vcc=600V, VGE=15V, Rg=5.6 ohm
200 Forward current : IF [ A ]
150 T j=125C 100
100
trr trr Irr Irr
(125C) (25C) (125C) (25C)
50
0 0 1 2 3 4 Forward on voltage : VF [ V ]
10 0 50 100 150 200 Forward current : IF [ A ]
Transient thermal resistance (max.)
1.000
FWD
Temperature characteristic (typ.)
100
Thermal resistanse : Rth(j-c) [ C/W ]
IGBT
0.100
Resistance : R [ k ohm ] 0.010 0.100 1.000
10
0.010
1
0.001 0.001
0.1 -60 -40 -20
0
20 40 60 80 100 120 140 160 180 Temperature [C ]
Pulse width : Pw [ sec ]
6MBI100UB-120
Outline Drawings, mm M633
IGBT Module
(
) shows reference dimension.
Equivalent Circuit Schematic
30,31,32
16,17,18
19
20
1 2 U 27,28,29 3 4 33,34,35
5 6
9 10 V 24,25,26 W 21,22,23
7 8
11 12 13,14,15


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